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Startups

Main Industry
Manufacturing
Main Product/Service
High-end specialty chemicals used in advanced semiconductor packaging processes, including UV release tape and wafer dicing tape.
Founded Year
2025
Unified Business No.
60407669
Status
Active
Total Paid-in Capital
370,000,000 (NT$)
Location of Company
Taiwan , Taoyuan City
Year of establishment, company status, responsible person, paid-in capital amount, and registered address are sourced from the "Commerce Industrial Services Portal, Department of Commerce, MOE. Exit status refers to various situations, including emerging stock exchanges (e.g., potential exits), mergers and acquisitions (M&A), and IPOs. The overseas development countries are collected through information provided by startups themselves and the information filled in when registering for matchmaking events. Therefore, the information cannot be updated in real time. If you wish to make corrections, please email findit.tier@gmail.com. Thank you. Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person. Please do not contact this platform for company inquiries.
About the Company
In response to advancements in AI and high-performance computing (HPC) packaging technologies, Advanced Pao Trusval Technology integrates semiconductor specialty materials, adhesive synthesis, and facility engineering technologies. Established in 2025 by AEMC (eChem), NAN PAO, and Shinhong Technology (6667), it focuses on the R&D and manufacturing of advanced semiconductor packaging adhesive materials such as UV debonding adhesives, wafer tapes, and protective films. The company aims to build a localized supply chain to meet the advanced packaging material needs of companies such as TSMC. It has established operations in the Southern Taiwan Science Park and acquired “Moli” to enhance production capabilities.



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