Database

Startups

Main Industry
Hardware
Main Product/Service
Chip Bonding Equipment
8210CW Fully Automated C2W Hybrid Bonding Equipment
8210CWW Fully Automated Hybrid Bonding Equipment

Surface Treatment Equipment
9500 Semi-Automated Super Atomic Beam Polishing Machine
9510 Fully Automated Super Atomic Beam TRIM Machine

Wafer Bonding Equipment
61 Series, 62 Series, 63 Series, and 64 Series Bonding Equipment

Process Foundry Services
Provides high-quality heterogeneous bonding material foundry services and comprehensive wafer processing services.
Founded Year
2025
Unified Business No.
60545831
Status
Active
Total Paid-in Capital
15,320,000 (NT$)
Location of Company
Taiwan , Hsinchu County
Year of establishment, company status, responsible person, paid-in capital amount, and registered address are sourced from the "Commerce Industrial Services Portal, Department of Commerce, MOE. Exit status refers to various situations, including emerging stock exchanges (e.g., potential exits), mergers and acquisitions (M&A), and IPOs. The overseas development countries are collected through information provided by startups themselves and the information filled in when registering for matchmaking events. Therefore, the information cannot be updated in real time. If you wish to make corrections, please email findit.tier@gmail.com. Thank you. Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person. Please do not contact this platform for company inquiries.
About the Company
Seiki Semiconductor provides advanced bonding solutions to promote sustainable growth in the semiconductor industry. Its technologies are widely applied in material bonding, sensing, communications, logic computing, storage, and optoelectronic semiconductor devices. The company has successfully launched the first locally developed “hybrid bonding packaging equipment,” using low-temperature plasma surface activation and atomic-level surface treatment technologies to address long lead times and limited customization issues from international equipment suppliers.



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