RAYTEK SEMICONDUCTOR, INC.
Update：2025/12/03
Industries
Main Industry
Manufacturing
Main Product/Service
Our services include the following:
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, set-top-boxes, bio-chips, and Testing wafers.
Front Side Metallization (FSM)
Backside Grinding and Backside Metallization (BGBM)
Application: Power discreet components such MOSFET and IGBT.
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, set-top-boxes, bio-chips, and Testing wafers.
Front Side Metallization (FSM)
Backside Grinding and Backside Metallization (BGBM)
Application: Power discreet components such MOSFET and IGBT.
Founded Year
2016
Unified Business No.
45079229
Status
Active
Number of Employees
0
Total Paid-in
Capital
1,223,610,000 (NT$)
Location of Company
Taiwan
, Hsinchu County
Year of establishment, company status, responsible person, paid-in capital amount, and registered address are sourced from the "Commerce Industrial Services Portal, Department of Commerce, MOE. Exit status refers to various situations, including emerging stock exchanges (e.g., potential exits), mergers and acquisitions (M&A), and IPOs. The overseas development countries are collected through information provided by startups themselves and the information filled in when registering for matchmaking events. Therefore, the information cannot be updated in real time. If you wish to make corrections, please email findit.tier@gmail.com. Thank you.
Exclusive content for members
Members-only content. Please log in to access.
About the Company
Raytek Semiconductor Inc. (abbreviated as Raytek) was funded in 2016, a high-tech semiconductor company dedicated to wafer-level packages. Raytek was established in Taiwan, and its vision is for the global market, focused on developing wafer-level packages and striving to be the most professional wafer-level RDL/Bumping supplier in Taiwan.
