Research

[Taiwan Startup Investments – Jan-Feb 2025] Notable Deals

Lin, Yu-Hsun | Assistant Research Fellow/Research Division VI, Taiwan Institute of Economic Research
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Taiwan’s early-stage investment market has long faced challenges due to limited information transparency. To address this issue, FINDIT research team at the Taiwan Institute of Economic Research (TIER) has been actively collecting and consolidating data from various sources in recent years. The team publishes annual updates on funded startups in Taiwan and newly established early-stage investment funds on a regular basis. In addition, monthly updates are released to share the latest publicly sourced news on Taiwan's funded startups. Among the highlights from January to February 2025, IC design company WHALECHIP CO., LTD. stood out by securing the largest funding amount, raising NT$328 million.

WHALECHIP CO., Ltd. Completes Approximately NT$328 Million Funding Round圖片

Source: Official Website of WHALECHIP

Funding News

        WHALECHIP CO., LTD. announced on January 7 the successful completion of a funding round of approximately NT$328 million. The investment was made by ASE Holdings, a leading semiconductor assembly and testing company, through its overseas subsidiary, increasing its stake in WHALECHIP to 7.5%. Moving forward, WHALECHIP will collaborate with ASE Holdings to advance IC design solutions for artificial intelligence (AI) and autonomous vehicles.

Company and Product Overview
        Established in 2017, WHALECHIP CO., LTD. is a IC design and WoW (Wafer-on-Wafer) 3DIC Turnkey service provider dedicated to technological innovation. The company specializes in the research and development of High-Performance Computing (HPC) ASICs (application-specific integrated circuits), distributed computing, and system-level solutions. WHALECHIP's WoW 3DIC technology utilizes advanced hybrid bonding wafer-level manufacturing technology to integrate chips with different types, structures, and process nodes into a unified system. Compared to the 2.5D CoWoS technology, which combines a System-on-Chip (SoC) with external DDR memory or high-bandwidth memory (HBM) to enhance performance, WoW 3DIC takes it a step further by significantly increasing connection density and quantity. This innovative technology eliminates the need for a PHY interface, shortens connection lengths, and reduces system power consumption and space requirements. As a result, it boosts data transmission bandwidth and enhances the overall computing performance of chip systems.

#ICDesign

 

For the official website and related news, please refer to the links below:

*Official Website: https://www.whalechip.com/en-us/

*Funding News: https://to.findit.org.tw/742fdt

 

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