資料庫

新創企業

主要應用領域
Hardware
產品/服務
創新半導體封裝技術(WBCSP).
成立年份
2018
統一編號
42986634
公司狀態
營運中
負責人
陳石磯
團隊人數
0
實收資本額
0 (元/新臺幣)
註冊地址
新竹縣竹北市縣政八街25巷1號2樓
成立年份、公司狀態、負責人、實收資本額、註冊地址均來自「經濟部商業發展署 全國商工行政服務入口網」;出場係指多元出場,包括準出場的興櫃、併購收購(M&A)及上市櫃(IPO);海外發展國別係透過新創企業自行提供,以及報名媒合活動時填寫資料進行蒐集,故無法即時更新,如欲更正, 請e-mail至findit.tier@gmail.com,謝謝。 註:本平台係透過蒐集公開資訊等方式,將公司資料彙整於網頁中供各界查詢,非該公司聯繫人,亦與該公司無直接關連,請勿致電詢問公司相關事宜。
公司簡介
我們提供的是一種創新的封裝技術(WBCSP),它只需用5個傳統封裝步驟就能完成WLCSP的封裝產品,這是一個獨創的技術。



看更多 ↓

更多相似新創企業

抱樸科技股份有限公司

半導體智財開發授權與顧問服務;原子級沉積技術/金屬薄膜代工服務;半導體電子元件銷售

抓取標籤API用

【氟18】氟去氧葡糖糖注射劑
Hardware 3D Printing 3D Technology Advanced Materials Aerospace Air Transportation Analytics Application Specific Integrated Circuit (ASIC) Artificial Intelligence (AI) Augmented Reality Automotive Autonomous Vehicles B2B B2C Battery Big Data Building Material Business Information Systems Business Intelligence Business Process Automation (BPA) CAD Chemical Chemical Engineering Civil Engineering Commerce Communication Hardware Communications Infrastructure Computer Vision Construction Consumer Consumer Software Corporate Training Cyber Security Delivery Digital Entertainment Digital Health Drone Management Drones Edutainment E-Learning Electronic Design Automation (EDA) Electronic Health Record (EHR) Electronics Embedded Software Embedded Systems Energy Energy Efficiency Energy Management Energy Storage Engineering Enterprise Field-Programmable Gate Array (FPGA) Flash Sale Fleet Management Geospatial Government GovTech GPS GPU Hardware Homeland Security Human Computer Interaction Human Resources IC Design Image Recognition Industrial Industrial Automation Industrial Design Industrial Engineering Industrial Manufacturing Information Technology Infrastructure Intelligent Systems Internet of Things IT Infrastructure Law Enforcement Location Based Services Logistics Machine Learning Machinery Manufacturing Manufacturing Mapping Services Marine Technology Marine Transportation Marketplace Mechanical Engineering Mechanical Equipment mHealth Military Mobile Apps National Security Natural Language Processing Natural Resources Navigation Network Hardware Optical Communication Personal Development Physical Security Procurement Project Management Public Safety RADAR Remote Sensing Retail Robotic Process Automation (RPA) Robotics Satellite Communication Science Security Semiconductor Sensor Sex Tech Skill Assessment Software Supply Chain Management Surveillance Telecommunications Test and Measurement Thermal Management Training TV Unified Communications Usability Testing Virtual Reality Water Transportation Web Apps Wellness Wholesale Wireless XR

芝和精密股份有限公司

提供半導體製程使用之硬脆材質精密零組件, 如:矽、石英、陶瓷…...等。提供服務項目包括1.蝕刻製程電極板細微加工 2.大型脆性光學元件減重加工 3.光纖通道深孔加工
:::
 
回頁面最頂端