1. Chemistry
2. Engineering
3. Semiconductor Consumables

Winsheng Material Technology offers a range of silicon carbide (SiC) wafer products, including 4-inch and 6-inch N-type SiC wafers, suitable for high-performance applications such as power semiconductors, electric vehicles, 5G communications, and solar energy. The company has successfully developed 6-inch SiC wafers and is actively engaged in the research and development of 8-inch SiC wafers to meet the future market demand for high-performance semiconductor materials.

SEMINC Silicon Nitride Plates(Si3N4)
Using ultra-pure silicon nitride powder as raw material, combined with unique sintering technology, it can perfectly exert the characteristics of the material. Physical properties such as bending strength, thermal conductivity, CTE and breakdown voltage can reach theoretical values. (Product Specifications for details)


High Strength: Enabling thinner & lighter components. Improving heat dissipation efficiency.
High Thermal Conductivity: Extended service life and improved energy efficiency.
Low CTE: Matched with silicon (Si) and silicon carbide (SiC), it’s the most reliable choice.
High Breakdown Voltage: The performance of insulation is good, and no risk of leakage in high-power use.