WHALECHIP WoW 3DIC technology adopts advanced Hybrid bonding wafer-level manufacturing technology to integrate chips of different types, different structures, and even different process nodes.

Compared with the SOC external DDR/HBM method in 2.5D CoWoS technology, WoW 3DIC technology significantly increases the connection density and quantity, while eliminating the need for the PHY interface and greatly shortening the connection length. These optimizations have significantly reduced system power consumption and occupied area, greatly increased data transmission bandwidth, solved the memory bottleneck problem, and greatly enhanced the overall computing performance of the chip system.