Main Industry
Content and Publishing
Main Product/Service
「Copper-Graphite」
Nano-graphite copper products provide a comprehensive solution to a common issue: artificial graphite's tendency to chip and break easily.
Using multiple molds leads to poor alignment accuracy, higher total processing costs due to additional film loading, and limited heat dissipation capability due to poor vertical thermal conductivity. Additionally, coating-type graphite, being a mixture of graphite and resin, suffers from significantly diminished heat conduction due to the resin (a poor thermal conductor). Moreover, resin degradation at high temperatures compromises reliability and leads to the drawback of coating delamination.
Achieving uniform heating, cooling, EMI shielding, high reliability, ease of processing, risk mitigation against detachment, and environmental friendliness with recyclability.「Heat Pipe」
Heat pipe is a highly efficient passive thermal conductor. Due to phase transition theory and capillary action, their thermal conductivity is improved by several orders of magnitude compared to pure copper of the same material.
「Principle of Heat Pipes」
After filling the copper core structure with the working fluid inside, the internal pressure is reduced to a negative value and then sealed. One side is the evaporator (heating side), and the other side is the condenser. The liquid between the capillary cores evaporates on the heating side when it starts working, and then the water vapor is driven by a slight pressure from the evaporator towards the condenser. The vapor condenses into water, releasing heat, and the liquid flows towards the evaporator side under capillary action along the copper core. So, the cycle continues, achieving the effect of heat conduction.「Vapor Chamber」
The vapor chamber is a vacuum cavity with microstructures on its inner walls. When heat is conducted from the heat source to the evaporator section, the working fluid inside the cavity begins to undergo phase change in the low vacuum environment. At this point, the working fluid absorbs heat energy and rapidly expands in volume.
The vapor phase of the working fluid quickly fills the entire cavity. When the vapor phase working fluid comes into contact with a cooler area, condensation occurs. Releasing the accumulated heat from evaporation.
After condensation, the liquid phase working fluid returns to the heat source through capillary action of the microstructures, and this operation continues cyclically within the chamber, constituting the operation principle of the vapor chamber. Furthermore, because the working fluid can generate capillary forces within the microstructures during evaporation, the operation of the vapor chamber is not affected by gravity. The theory of the vapor chamber is similar to that of a heat pipe; however, while a heat pipe conducts heat in one dimension, the isothermal plate conducts heat in two dimensions. Therefore, theoretically, the heat conduction capability of the vapor chamber is much greater than that of a heat pipe.
「Brushless DC Cooling Fan」
In this era of computational explosion, maintaining high product efficiency has made cooling solutions indispensable, with cooling fans playing a crucial role. Whether applied in electromechanical equipment or electronic products, cooling fans are essential heat dissipation devices. By facilitating airflow, they provide sufficient cool air to reduce device temperatures, ensuring products operate efficiently even at high speeds without performance issues from overheating.
In portable electronic devices, from initial low-power electronic components to multi-functional IC, extending to high-power electronic products meeting market demands for lighter, slimmer designs, the squeezing of cooling space is restricted. Fans serve to enforce airflow circulation. Through various fan blade designs, they generate strong airflow pressure and excellent heat dissipation performance to maintain a cooling environment for IC during high-speed operations, ensuring stable clock frequencies and optimizing product performance.
「Liquid Cooling Module」
Liquid cooling is better than traditional air cooling for high-performance computing(HPC) like AI servers because it's more efficient at handling heat. Compared to air-cooled servers that require fans for heat dissipation, removing the fan modules and adopting a heat flow design can significantly increase the density of CPU and GPU. This allows for more computational power within limited space, reducing energy consumption, which in turn indicates better Power Usage Effectiveness (PUE).It also helps protect server products from exceeding specified Thermal Design Power (TDP), enhancing server reliability, availability, and even improving chip computational efficiency.
Liquid cooling utilizes liquid as a heat conduction mechanism for heat dissipation. There are two common types of liquid cooling technologies for servers on the market: direct liquid cooling and immersion cooling. These categories can be further divided into single-phase immersion cooling and two-phase immersion cooling.
Direct liquid cooling assists servers in dissipating heat by surrounding key components inside the server with sealed pipelines filled with coolant (also known as closed-loop cooling systems). Heat from the components is conducted to the coolant via heat-conductive copper plates. Subsequently, the coolant flows out of the server along the pipelines, dissipates heat through heat exchangers, and eventually returns to the server for further use.「Thermal module」
The thermal module integrates heat pipes, heat spreaders, fins, and cooling fans into an optimal cooling solution. With extensive industry experience, GrAndvance specializes in creating customized cooling solutions tailored to specific systems or offering standard heat pipe modules, 2D/3D heat spreader modules, and more. GrAndvance is your best choice for achieving efficient thermal management.
Nano-graphite copper products provide a comprehensive solution to a common issue: artificial graphite's tendency to chip and break easily.
Using multiple molds leads to poor alignment accuracy, higher total processing costs due to additional film loading, and limited heat dissipation capability due to poor vertical thermal conductivity. Additionally, coating-type graphite, being a mixture of graphite and resin, suffers from significantly diminished heat conduction due to the resin (a poor thermal conductor). Moreover, resin degradation at high temperatures compromises reliability and leads to the drawback of coating delamination.
Achieving uniform heating, cooling, EMI shielding, high reliability, ease of processing, risk mitigation against detachment, and environmental friendliness with recyclability.「Heat Pipe」
Heat pipe is a highly efficient passive thermal conductor. Due to phase transition theory and capillary action, their thermal conductivity is improved by several orders of magnitude compared to pure copper of the same material.
「Principle of Heat Pipes」
After filling the copper core structure with the working fluid inside, the internal pressure is reduced to a negative value and then sealed. One side is the evaporator (heating side), and the other side is the condenser. The liquid between the capillary cores evaporates on the heating side when it starts working, and then the water vapor is driven by a slight pressure from the evaporator towards the condenser. The vapor condenses into water, releasing heat, and the liquid flows towards the evaporator side under capillary action along the copper core. So, the cycle continues, achieving the effect of heat conduction.「Vapor Chamber」
The vapor chamber is a vacuum cavity with microstructures on its inner walls. When heat is conducted from the heat source to the evaporator section, the working fluid inside the cavity begins to undergo phase change in the low vacuum environment. At this point, the working fluid absorbs heat energy and rapidly expands in volume.
The vapor phase of the working fluid quickly fills the entire cavity. When the vapor phase working fluid comes into contact with a cooler area, condensation occurs. Releasing the accumulated heat from evaporation.
After condensation, the liquid phase working fluid returns to the heat source through capillary action of the microstructures, and this operation continues cyclically within the chamber, constituting the operation principle of the vapor chamber. Furthermore, because the working fluid can generate capillary forces within the microstructures during evaporation, the operation of the vapor chamber is not affected by gravity. The theory of the vapor chamber is similar to that of a heat pipe; however, while a heat pipe conducts heat in one dimension, the isothermal plate conducts heat in two dimensions. Therefore, theoretically, the heat conduction capability of the vapor chamber is much greater than that of a heat pipe.
「Brushless DC Cooling Fan」
In this era of computational explosion, maintaining high product efficiency has made cooling solutions indispensable, with cooling fans playing a crucial role. Whether applied in electromechanical equipment or electronic products, cooling fans are essential heat dissipation devices. By facilitating airflow, they provide sufficient cool air to reduce device temperatures, ensuring products operate efficiently even at high speeds without performance issues from overheating.
In portable electronic devices, from initial low-power electronic components to multi-functional IC, extending to high-power electronic products meeting market demands for lighter, slimmer designs, the squeezing of cooling space is restricted. Fans serve to enforce airflow circulation. Through various fan blade designs, they generate strong airflow pressure and excellent heat dissipation performance to maintain a cooling environment for IC during high-speed operations, ensuring stable clock frequencies and optimizing product performance.
「Liquid Cooling Module」
Liquid cooling is better than traditional air cooling for high-performance computing(HPC) like AI servers because it's more efficient at handling heat. Compared to air-cooled servers that require fans for heat dissipation, removing the fan modules and adopting a heat flow design can significantly increase the density of CPU and GPU. This allows for more computational power within limited space, reducing energy consumption, which in turn indicates better Power Usage Effectiveness (PUE).It also helps protect server products from exceeding specified Thermal Design Power (TDP), enhancing server reliability, availability, and even improving chip computational efficiency.
Liquid cooling utilizes liquid as a heat conduction mechanism for heat dissipation. There are two common types of liquid cooling technologies for servers on the market: direct liquid cooling and immersion cooling. These categories can be further divided into single-phase immersion cooling and two-phase immersion cooling.
Direct liquid cooling assists servers in dissipating heat by surrounding key components inside the server with sealed pipelines filled with coolant (also known as closed-loop cooling systems). Heat from the components is conducted to the coolant via heat-conductive copper plates. Subsequently, the coolant flows out of the server along the pipelines, dissipates heat through heat exchangers, and eventually returns to the server for further use.「Thermal module」
The thermal module integrates heat pipes, heat spreaders, fins, and cooling fans into an optimal cooling solution. With extensive industry experience, GrAndvance specializes in creating customized cooling solutions tailored to specific systems or offering standard heat pipe modules, 2D/3D heat spreader modules, and more. GrAndvance is your best choice for achieving efficient thermal management.
Founded Year
2018
Unified Business No.
69752217
Status
Active
Number of Employees
17
Total Paid-in
Capital
10,570,400 (NT$)
Location of Company
Taiwan
, New Taipei City
Year of establishment, company status, responsible person, paid-in capital amount, and registered address are sourced from the "Commerce Industrial Services Portal, Department of Commerce, MOE. Exit status refers to various situations, including emerging stock exchanges (e.g., potential exits), mergers and acquisitions (M&A), and IPOs. The overseas development countries are collected through information provided by startups themselves and the information filled in when registering for matchmaking events. Therefore, the information cannot be updated in real time. If you wish to make corrections, please email findit.tier@gmail.com. Thank you.
Exclusive content for members
Members-only content. Please log in to access.
About the Company
GrAndvance Technology is dedicated to providing thermal solutions for electronic products. Our main products include high-efficiency DC cooling fans, thermal modules, and liquid cooling systems, assisting customers in system thermal solution planning. We offer one-stop services from design, simulation, to manufacturing. Our applications span across AI-related technologies, handheld devices, electric vehicles, new energy, communications, and server fields.
