The application market covers a wide range of 5G millimeter-wave, satellite communications, fiber to the home, and data center. Our main products include:
1. 5G mmwave, satellite communication SAT-IF bandwidth, and CATV RFOF(RF over Fiber) module;
2.

Voltraware’s “Snip-Wire” concept emphasizes a departure from traditional wired charging, paving the way for more efficient and environmentally friendly solutions. This revolutionary approach to wireless power transfer positions Voltraware at the forefront

1. Precision Sensors and Measurement Technology 精密感測與測量技術
Smart Sensing Wafer

Vibration and Angle Recorder

iLD wireless horizontal angle measuring instrument

iVD vibration Response Module

Acoustic Camera

iVS Miniature vibration sensor

Pressure Unifo

Gechi 6-Inch N-Type Silicon Carbide (SiC) Ingot & Wafer
Premium Substrates for Advanced Compound Semiconductor Applications

Gechi specializes in high-quality compound semiconductor materials, offering both 6-inch N-Type Silicon Carbide (SiC) ingots and wafers designed to meet the demanding requirements of high-power, high-frequency, and high-temperature electronic devices. With stringent quality controls and advanced manufacturing, our products ensure excellent crystal integrity, electrical performance, and surface precision.

6-Inch N-Type Silicon Carbide Ingot
Our SiC ingots feature ultra-low micropipe density, precise crystal orientation, and stable resistivity, making them ideal for high-performance device fabrication. Manufactured with rigorous quality standards, these ingots exhibit no cracks, hexagonal plate defects, or polytype inclusions. They are available in production and dummy grades with thicknesses greater than 8 mm and 5 mm, respectively.

6-Inch N-Type Silicon Carbide Wafer
Gechi’s wafers are sliced from high-grade ingots and polished to meet strict flatness, roughness, and defect criteria. They offer ultra-low micropipe densities, consistent resistivity, and excellent surface quality, including minimal scratches and edge chips. Both production and dummy grades are available to accommodate various application needs. The wafers maintain tight tolerances on thickness, orientation, and flat length to ensure compatibility with advanced semiconductor processes.