EMISSION CONTROL SOLUTIONS
Air Intake System
Air intake system is the main mechanism that supplement the engine.
The system filters incoming air, eliminates harmful dusts, and generates ignition. It lessens detritions of the cylinder and help to reduces exhaust emission from automobiles and motorcycles.
Manufacturing the system and its components for over three decades, SENTEC Group gains extensive experiences in its mass production. The advanced intake system we make includes all kinds of Air Cleaner, Air Filter, Air Intake Pipe, Rubber Hoses and a series of parts and components for automobiles and motorcycles.
From design, development testing, real vehicle verification to manufacturing, SENTEC Group provides satisfying, customized and one-stop service to tailor for every customer's needs.
Evaporative Emission Control System (EEC)
EEC is an important system for the prevention of automotive emission.
Under the influence of environmental temperature, petrol turns to hydrocarbon gas and aborb by the canister system before channel to the engine for ignition.
As most hydrocarbons are harmful to human health, many governments have legislated to restrict the amount of hydrocarbon emission by automobiles and motorcycles.
As most hydrocarbons are harmful to human health, many governments have legislated to restrict the amount of hydrocarbon emission by automobiles and motorcycles.
In accordance with various government regulations and market needs, Sentec Group provides our broad range of clients various customized solutions such as Activated-carbon Canister, One-way Valve, Two-way Valve, Rollover Valve and Purge Control Valve for automobiles and motorcycles, off-the-shelf parts, as well as production and verification services of parts.
Exhaust After Treatment System
Sentec Group focus on the promotion of this product series and by adopting world wide government regulations like EU5, Taiwan Phase 7, EPA Phase 3 for motorcycle and small off road engines (generator, lawn mower, etc).
SENTEC provides parts and accessories such as Automotive Catalytic Converter, Motorcycle Catalytic Converter for customized needs. We also integrate a series of processes including Research and Development, Design, Evaluation, and Manufacture to provide our customers the most reliable and top-quality products products and services.
ELECTRO CERAMIC & DEVICE
High Frequency & Hermetic Package
Sentec provides LTCC substrate that can be used under highly hermetic circumstances.
The hermetic level of 5.0 x 10-8Pa x m3/sec is assured through helium leak testing.
Also, Sentec offers Hybrid Solution thru. Interconnection Technology for high frequency application:
Low Loss LTCC with Electro Casting Copper Metallization+ Multi-Layer LTCC + AlN with Electro Casting Copper Metallization
Low Loss LTCC with Electro Casting Copper Metallization + Standard LTCC
Low Loss LTCC with Electro Casting Copper Metallization + Non-Shrinkage LTCC
Photonic & Thermal Electric
ECC (Electro Casting Copper) is an excellent choice for high power, high temperature applications. ECC technology could be applied on:
Various ceramic materials such as Al2O3, AlN,etc. are available.
Ultra thin ceramic substrate thickness of 0.2 mm is available.
Either single or double plating with via or without via design are applicable.
Power Electronics
With high conductivity substrate and high reliability, Sentec offer three solutions:
90 W/m'k & 130 W/m'K AMB SiN
Ultra Thin Al2O3/ZrO DBC (>800Mpa) Ceramic
170W/m'k ECC AlN
Ceramic in Board
Interposer & Heterogeneous
Sentec provides multilayer ceramic substrates, with multilayer thin-film metallization for wafer probe cards.
Turnkey Semiconductor Module Packaging OEM
Sentec offers turnkey solutions for module assembly. Depending on the nature of the project, we can perform:
Level 1 & 2 Packaging
SMT & Vacuum Reflow
Die Bond: Solder, Au/Sn or Ag sintering
Wire or Ribbon Bond & Cu Clip
Flip Chip: GGI, C4
Hermetic Sealing (Au/Sn)
Encapsulation (Potting & Molding)
Dicing Saw Singulation
Application
SiP/MCM Module
Hermetic Sealing Module(GaN MMIC)
Power Semiconductor Module(Si, GaN & SiC power device)
Heterogenous Module MECHATRONICS (OEM) FOUNDRY SERVICE
Material
Current Material Selection for Design Partners:
Stator & rotor material selection
Electrical steel with high magnetic flux density
Self-bonded electrical steel
Grain boundary diffusion magnet
High Temp. Magnet Selection (ex. 150°C)
Magnet without Heavy Rare earth
Insulation material selection
‧ Material Analysis Laboratory- XRD, ICP, XRF, TMA, SEM, etc.
Simulation
Design Validation Support:
As an OEM, we also provide FAE service for below items
Simulation Capabilites :
Electromagnetic
Thermal
Structural
Stress
3D moldeling
SMT & Vacuum Reflow
SMT (J-STD-001 & IPC-A-610 Standard):
Our experience is in high power application such as automotive powertrain system. We are your reliable partner in surface mount technology assembly.
Our engineers have been more than 20 years experience and we take pride in our work. Although the equipment and processes have changed over these years, one thing has not – our commitment to your project.
Today, we utilize state-of-the-art, fully automated placement equipment to quickly and accurately assemble SMT PCB (printed circuit board) assemblies.
Motor & Controller Integration
Integrating motor and controller together is the trend due to higher power density and shorter BOM list.
We help our partners to customize power inverter into a module rather discrete solution in order to shrink the size of the system:
Co-design project for various applications
Innovative technology to solve heat, IP level, vibratation, etc.
Motor winding & assembly is also welcome
Testing
Complete verification capabilites included :
Dynamometer Laboratory
Speed up to 20000 rpm and torque over 226 Nm.
Automated control, monitoring and data acquisition with torque/speed profile.
Environmental testing with PLC. Temp. range from -40 to 120 oC, Humidity range from 30 to 95 %
Motorcycle Riding Dynamometer Laboratory
Electric & magnetic testing
Power Analyzer, LCR meter, BH-tracer, etc.
