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主要應用領域
Science and Engineering
產品/服務
以特殊設計的硬體與製程,實現以電將進行純物理蝕刻。有電子束、離子束、雷射能隊幾乎任意材料加工的特性,但又有半導體蝕刻製程的大規模同步加工特性。
成立年份
2014
統一編號
24613747
公司狀態
營運中
負責人
楊政衛
團隊人數
0
實收資本額
44,012,783 (元/新臺幣)
註冊地址
新竹市北區磐石里文雅街126號1樓
網站連結
成立年份、公司狀態、負責人、實收資本額、註冊地址均來自「經濟部商業發展署 全國商工行政服務入口網」;出場係指多元出場,包括準出場的興櫃、併購收購(M&A)及上市櫃(IPO);海外發展國別係透過新創企業自行提供,以及報名媒合活動時填寫資料進行蒐集,故無法即時更新,如欲更正, 請e-mail至findit.tier@gmail.com,謝謝。 註:本平台係透過蒐集公開資訊等方式,將公司資料彙整於網頁中供各界查詢,非該公司聯繫人,亦與該公司無直接關連,請勿致電詢問公司相關事宜。
公司簡介
發展非接觸純物理電漿蝕刻技術,對現有加工技術難以加工的材料進行加工。例如有機材料、生醫產品、陶瓷材料之加工。



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