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Hardware
產品/服務
專業碳化矽(SiC)技術供應商,提供6吋N-type 晶圓、6吋N-type 晶體
成立年份
2022
統一編號
90282276
公司狀態
營運中
負責人
熊觀明
團隊人數
0
實收資本額
800,000,000 (元/新臺幣)
註冊地址
桃園市中壢區西園路99之9號
成立年份、公司狀態、負責人、實收資本額、註冊地址均來自「經濟部商業發展署 全國商工行政服務入口網」;出場係指多元出場,包括準出場的興櫃、併購收購(M&A)及上市櫃(IPO);海外發展國別係透過新創企業自行提供,以及報名媒合活動時填寫資料進行蒐集,故無法即時更新,如欲更正, 請e-mail至findit.tier@gmail.com,謝謝。 註:本平台係透過蒐集公開資訊等方式,將公司資料彙整於網頁中供各界查詢,非該公司聯繫人,亦與該公司無直接關連,請勿致電詢問公司相關事宜。
公司簡介
格棋化合物半導體為專業碳化矽晶體(Ingot)與晶圓(Wafer)供應商,擁有自主先進研發團隊,並具備獨特長晶工藝與量產能力,可協助客戶打造兼具高效能與高可靠性的碳化矽晶片。格棋化合物半導體團隊深耕晶體成長工藝技術,目前已具備6吋N-type晶體量產製程能力,並在5月成功開發出8吋N-type晶體及6吋半絕緣晶體。除了長晶技術外,公司也具備有切磨拋光技術開發能力,對於製程進行晶圓切片工作及提供客戶對接時更完整的產品與技術服務。



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