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主要應用領域
Hardware
產品/服務
聚焦於資料中心高速互連領域,開發具低損耗與高頻寬密度的 2D 陣列面射型光耦合技術(2D array vertical coupling technology),推出兩項創新解決方案:Micro-LED 陣列式高速光通訊模組,以及整合 CW Laser 與高速光波導調變器的光子積體電路(PIC)平台。
成立年份
2025
統一編號
60670204
公司狀態
營運中
負責人
陳書履
團隊人數
0
實收資本額
137,527,000 (元/新臺幣)
註冊地址
新竹縣竹北市竹北里台元一街6號8樓之1
成立年份、公司狀態、負責人、實收資本額、註冊地址均來自「經濟部商業發展署 全國商工行政服務入口網」;出場係指多元出場,包括準出場的興櫃、併購收購(M&A)及上市櫃(IPO);海外發展國別係透過新創企業自行提供,以及報名媒合活動時填寫資料進行蒐集,故無法即時更新,如欲更正, 請e-mail至findit.tier@gmail.com,謝謝。 註:本平台係透過蒐集公開資訊等方式,將公司資料彙整於網頁中供各界查詢,非該公司聯繫人,亦與該公司無直接關連,請勿致電詢問公司相關事宜。
公司簡介
光循科技(Brillink Inc.)成立於 2025 年,專注於 AI 驅動的高速光通訊與矽光子整合解決方案。公司技術以先進 2D 陣列面射型光耦合技術為核心,橫跨 PDK/ADK之光子積體電路IP的AI 設計、及結合Micro-LED 、超高靈敏度 PD及Meta-optics 超穎光學封裝的光引擎,為全球少數同時具備上游晶片及光耦合技術與完整系統設計能力的全方位光通訊公司。Brillink 的願景是「以光速連結智慧」,致力於打造支撐下一代 AI 與資料中心運算成長的光速基礎設施。



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